Engineering Library — Coverage Roadmap

What’s covered, what’s deferred. Updated as tiers complete.

Decision log

  • 2026-05-14 — Project initiated. Scope: all major engineering disciplines (mechanical, electrical/electronic, materials, control, structural, civil, chemical, biomedical, aerospace, manufacturing, software/embedded, industrial, thermal, fluids). Structure mirrors the Languages library. Sister library Robotics/ integrates these for robotic systems.

Tier 1 — Candidate set (proposed, pending user confirmation)

Tier 1 spans ~45 deep notes across all disciplines — wider than Robotics because the discipline footprint is larger. Each row is a candidate deep note.

Mechanical (7)

#TopicSlug
1Statics — equilibrium, free-body diagramsstatics-fundamentals.md
2Mechanics of materials — stress, strain, modulusmechanics-of-materials.md
3Beam theory — bending, shear, deflectionbeam-theory.md
4Machine elements — fasteners, bolts, threadsfasteners-bolts.md
5Bearings — ball, roller, sleeve, thrustbearings.md
6Gears & power transmissiongears-power-transmission.md
7Vibration & dynamicsvibration-dynamics.md

Materials (6)

#TopicSlug
8Steel — grades, alloys, heat treatmentmaterials-steel.md
9Aluminum alloys — wrought & castmaterials-aluminum.md
10Engineering polymers — thermoplastics, thermosets, elastomersmaterials-polymers.md
11Composites — CFRP, GFRP, metal-matrixmaterials-composites.md
12Engineering ceramicsmaterials-ceramics.md
13Materials selection — Ashby charts, trade-off methodologymaterials-selection.md

Electrical (5)

#TopicSlug
14Circuit analysis fundamentals — KCL, KVL, Thevenin/Nortoncircuit-analysis.md
15AC analysis — phasors, impedance, three-phaseac-analysis-three-phase.md
16Electric motors — DC, AC induction, BLDC, stepper, synchronouselectric-motors.md
17Transformers & power-system fundamentalstransformers-power-systems.md
18Electromagnetics for engineers — Maxwell’s equations appliedelectromagnetics-engineering.md

Electronics (6)

#TopicSlug
19Semiconductor devices — diodes, BJT, MOSFET, IGBTsemiconductor-devices.md
20Op-amps — topologies, real-world limits, designop-amps.md
21Digital logic — combinational, sequential, FSMsdigital-logic.md
22Power electronics — switching converters, rectifiers, inverterspower-electronics.md
23PCB design — stack-up, routing, signal integrity, EMIpcb-design.md
24Microcontrollers & SoCs — architecture, peripherals, firmware basicsmicrocontrollers.md

Control systems (4)

#TopicSlug
25Classical control — root locus, Bode, Nyquist, lead-lagclassical-control.md
26State-space methods — controllability, observability, LQRstate-space-methods.md
27Digital control — sampling, Z-transform, discretizationdigital-control.md
28Model predictive control (MPC)mpc-control.md

Thermal / fluid (5)

#TopicSlug
29Thermodynamics — laws, cycles, exergythermodynamics.md
30Heat transfer — conduction, convection, radiationheat-transfer.md
31Fluid mechanics — incompressible, Bernoulli, viscosity, Reynoldsfluid-mechanics.md
32Pumps, fans, turbomachinerypumps-turbomachinery.md
33HVAC fundamentalshvac-fundamentals.md

Structural / civil (3)

#TopicSlug
34Structural analysis — trusses, frames, indeterminate structuresstructural-analysis.md
35Concrete & reinforced-concrete designreinforced-concrete.md
36Steel design & seismic detailingsteel-design.md

Manufacturing / industrial (4)

#TopicSlug
37Machining — turning, milling, grinding, EDM, CNCmachining.md
38Joining — welding, brazing, soldering, adhesivesjoining-welding.md
39Additive manufacturing — FDM, SLA, SLS, MJF, DMLSadditive-manufacturing.md
40Casting, forging & forming processescasting-forging-forming.md

Aerospace / chemical / biomedical / software-embedded (5)

#TopicSlug
41Aerodynamics fundamentals — lift, drag, compressibilityaerodynamics.md
42Propulsion — turbojet, turbofan, rocketpropulsion.md
43Chemical-process fundamentals — mass/energy balance, reactions, separationschemical-process-fundamentals.md
44Real-time embedded systems — RTOS, scheduling, jitterrealtime-embedded.md
45FPGA design — RTL, synthesis, timing closurefpga-design.md

Total: 45 candidate Tier 1 deep notes.

Tier 2 — Deferred (likely candidates)

Fracture mechanics, fatigue analysis, FEM/FEA, CFD, advanced control (H-infinity, sliding mode, adaptive), signal processing, RF design, antenna theory, photonics, semiconductor processing, mems, microfluidics, biomechanics, bioinstrumentation, environmental engineering, transportation engineering, soil mechanics, hydraulics, structural dynamics, plate & shell theory, advanced concrete, steel-connection design, masonry, timber, pre-stressed concrete, refrigeration cycles, internal-combustion engines, gas turbines, spacecraft attitude control, orbital mechanics, GNC, hypersonics, reliability engineering, ergonomics, lean manufacturing, six-sigma, quality systems, supply-chain, project management for engineers.

Tier 3 — Encyclopedic family indexes (planned)

  • Steel grades — every ASTM/AISI/EN designation in one indexed table
  • Aluminum alloys — 1xxx-7xxx series + cast designations
  • Engineering polymers — thermoplastics + thermosets + elastomers exhaustive
  • Composites — CFRP/GFRP/AFRP variants, MMC, CMC
  • Fasteners — every screw / bolt / rivet / nail family
  • Bearings — every rolling-element + plain bearing style
  • Gears — spur / helical / bevel / worm / planetary / harmonic
  • Standard structural shapes — W / S / HP / C / L / HSS profiles
  • Electric motors taxonomy — every motor type (also cross-linked to Robotics/Tier3 if we add one there)
  • Semiconductor packages — every IC package family
  • Op-amp variants — every topology + key parameter
  • PCB substrates — FR-4 / Rogers / ceramic / flex
  • Heat-transfer correlations — empirical Nusselt-number correlations
  • Pipe schedules & fittings — NPS / DN sizes
  • Welding processes — SMAW / GMAW / GTAW / FCAW / SAW / laser / etc.
  • Additive-manufacturing processes — full taxonomy
  • Standards bodies — ASTM / ISO / IEC / IEEE / SAE / ASME / DIN / JIS / GB
  • … and many more

Process

Same as Languages:

  1. User confirms Tier 1 candidate set (or modifies it).
  2. Parallel sub-agents write the deep notes in batches of 5.
  3. Cross-cutting sections (units cheatsheet, materials-selection method, factor-of-safety guide) follow.
  4. Tier 3 family indexes after Tier 1+2 are done.

Adjacent-library coverage

  • Robotics library applies these foundations to robotic systems.
  • Languages/Tier3 catalogues description-languages for many engineering domains (IFC for construction, gbXML for energy, EnergyPlus IDF for thermal, IEC 61850 SCL for power utilities, etc.) — already complete.