Heat Transfer Correlations — Family Index

Working reference for convective heat-transfer correlations (single-phase forced, natural, two-phase), extended-surface efficiency, compact heat exchangers, radiation, contact resistance, and heat-pipe limits. SI throughout. Each correlation lists its valid range — extrapolation outside is the most common source of design error.


1. At a glance — the pillars

The convective h-coefficient has no closed-form first-principles value; it is built from empirical correlations binned by:

  • Forced convection internal — flow inside pipes, ducts, annuli, microchannels. Driver: pump/fan ΔP. Re from bulk velocity.
  • Forced convection external — flow over plates, cylinders, spheres, tube banks. Driver: free-stream velocity. Boundary-layer development.
  • Natural / free convection — buoyancy-driven (Gr, Ra). Vertical plates, horizontal plates up/down, cylinders, spheres, enclosures.
  • Two-phase — boiling — nucleate, transition, film. Pool vs flow boiling. CHF (departure from nucleate boiling).
  • Two-phase — condensation — film vs dropwise. Vertical plate, horizontal tube, in-tube, tube banks.
  • Two-phase — evaporation — spray, falling film, falling-film evaporator.
  • Fin / extended surfaces — straight, annular, pin, louvered. η_f and overall η_o.
  • Compact heat exchangers — high area density (>700 m²/m³). j-Colburn and f vs Re. NTU-ε.
  • Radiation — σT⁴, view factors, gray-diffuse network, combined convective-radiative h.
  • Contact resistance — TIM thermal interface materials, bond-line, joint conductance.
  • Heat pipes / vapor chambers — capillary, sonic, entrainment, boiling limits.

2. Dimensionless groups — the language

GroupDefinitionPhysical meaningTypical values
ReρVL/µ = VL/νinertial / viscouspipe laminar <2300, turbulent >4000
Prµcp/k = ν/αmomentum / thermal diffusivityair ~0.71, water 6.1 at 20°C, light oil ~3000, liquid metal Na ~0.005
NuhL/k_fluidconvective / conductive in fluid4–10 laminar pipes, 100–1000 turbulent
GrgβΔT·L³/ν²buoyancy / viscousnatural-convection driver
RaGr·Prbuoyancy × Pronset of turbulence ~10⁹ vertical plate
PeRe·Pradvection / diffusionimportant for liquid metals
BihL_c/k_bodyconduction inside / convection outside<0.1 → lumped capacitance OK
Foαt/L_c²dimensionless timetransient conduction
StNu/(Re·Pr) = h/(ρcpV)wall heat flux / advective enthalpy fluxdrag-heat-transfer analogy
Jacp·ΔT/h_fgsensible / latentphase-change driver
Boq”/(G·h_fg)boiling numberflow-boiling map
Co(ρ_v/ρ_l)^0.5·((1-x)/x)^0.8convective numberflow-boiling map

Properties evaluated at film temperature T_f = (T_s + T_∞)/2 unless correlation specifies otherwise. Variable-property corrections (µ_∞/µ_s)^n appear in many.


3. Internal forced convection — pipes and ducts

Laminar fully-developed circular tube (Re < 2300)

  • Constant wall heat flux q”: Nu_D = 4.36
  • Constant wall temperature T_s: Nu_D = 3.66
  • Entry-length combined (Kays-Crawford, Hausen for T-const): Nu_D = 3.66 + 0.0668·(D/L)·Re·Pr / (1 + 0.04·[(D/L)·Re·Pr]^(2/3))
  • Sieder-Tate (large ΔT, property variation): Nu_D = 1.86·(Re·Pr·D/L)^(1/3)·(µ/µ_s)^0.14, valid (Re·Pr·D/L)^(1/3)·(µ/µ_s)^0.14 ≥ 2.

Turbulent fully-developed circular tube

Dittus-Boelter (1930) — simplest, widely used: Nu_D = 0.023·Re^0.8·Pr^n, n = 0.4 heating fluid, 0.3 cooling fluid. Range: 0.7 < Pr < 160, Re > 10000, L/D > 10. Accuracy ±25%, properties at bulk T.

Gnielinski (1976) — more accurate, modest Re extended: Nu_D = (f/8)(Re - 1000)·Pr / (1 + 12.7·√(f/8)·(Pr^(2/3) - 1)) with Petukhov friction factor for smooth tubes: f = (0.790·ln(Re) - 1.64)^(-2). Range: 0.5 < Pr < 2000, 3000 < Re < 5×10⁶. Accuracy ±10%.

Sieder-Tate (turbulent variable-property): Nu_D = 0.027·Re^0.8·Pr^(1/3)·(µ/µ_s)^0.14 Used for oils with large viscosity variation.

Non-circular ducts

Hydraulic diameter D_h = 4A_c/P (P wetted perimeter). Turbulent: use D_h in Dittus-Boelter / Gnielinski directly. Laminar: Nu varies with cross-section shape.

Cross-sectionNu_D,T (T const)Nu_D,H (q” const)
Circular3.664.36
Square (a×a)2.983.61
2:1 rectangle3.394.12
4:1 rectangle4.445.33
8:1 rectangle5.606.49
Parallel plates (b→∞)7.548.23
Triangular equilateral2.473.11

Curved pipes / coils

Dean number De = Re·(D/D_coil)^0.5. Secondary flow enhances h. Schmidt: Nu_curved/Nu_straight = 1 + 3.6·(1 - D/D_coil)·(D/D_coil)^0.8 in turbulent.

Rough tubes

Friction factor from Moody (Colebrook) replaces Petukhov-smooth in Gnielinski; the (f/8) numerator increases but the friction term in the denominator also rises — net Nu increase modest (factor ~2 typical for sand-grain ε/D = 0.05).


4. External forced convection

Flat plate (parallel flow)

Laminar (Re_x < 5×10⁵):

  • Local: Nu_x = 0.332·Re_x^0.5·Pr^(1/3), Pr ≥ 0.6
  • Average 0→L: Nu_L = 0.664·Re_L^0.5·Pr^(1/3)
  • Low Pr (liquid metals, Pr < 0.05): Nu_x = 0.565·(Re_x·Pr)^0.5

Turbulent (5×10⁵ < Re_x < 10⁸):

  • Local: Nu_x = 0.0296·Re_x^0.8·Pr^(1/3), 0.6 < Pr < 60
  • Average mixed boundary (transition at Re_c = 5×10⁵): Nu_L = (0.037·Re_L^0.8 - 871)·Pr^(1/3)

Cylinder cross-flow

Churchill-Bernstein (single correlation, all Re·Pr > 0.2): Nu_D = 0.3 + (0.62·Re^0.5·Pr^(1/3)) / (1 + (0.4/Pr)^(2/3))^(1/4) · (1 + (Re_D/282000)^(5/8))^(4/5) Valid all Re_D; properties at film T. Accuracy ±20%.

Hilpert (older, Re-banded): Nu_D = C·Re_D^m·Pr^(1/3), C and m vary with Re band (e.g. 40<Re<4000 → C=0.683, m=0.466).

Sphere

Whitaker: Nu_D = 2 + (0.4·Re_D^0.5 + 0.06·Re_D^(2/3))·Pr^0.4·(µ_∞/µ_s)^(1/4) Range: 3.5 < Re_D < 7.6×10⁴, 0.71 < Pr < 380, 1.0 < µ_∞/µ_s < 3.2. Limit Re→0: Nu_D = 2 (pure conduction sphere into infinite fluid).

Ranz-Marshall (droplets, gas): Nu_D = 2 + 0.6·Re^0.5·Pr^(1/3).

Tube banks (cross-flow)

Zukauskas (1972): Nu_D = C₁·C₂·Re_D,max^m·Pr^0.36·(Pr/Pr_s)^0.25 Re_D,max uses V_max at minimum free-area gap. C₁ depends on layout (aligned vs staggered) and S_T/S_L. C₂ corrects for number of rows N_L < 16. m bins by Re_D,max (e.g. 1000–2×10⁵ → m ≈ 0.60 staggered, 0.63 aligned). Tables in Incropera Ch. 7.

Impinging jets

Martin correlation for single round jet: Nu_D = 2·Re^0.5·(1 + 0.005·Re^0.55)^0.5·Pr^0.42·[1 - 1.1·(D/r)] / [1 + 0.1·(H/D - 6)·(D/r)] where H/D is nozzle-to-plate spacing, r is radial position. Local h peaks at r/D ≈ 0.5 stagnation, secondary at r/D ≈ 6–8.


5. Natural / free convection

Driver: gβΔT, where β = thermal expansion coefficient (= 1/T_film for ideal gas).

Vertical plate

Churchill-Chu (all Ra): Nu_L = {0.825 + 0.387·Ra_L^(1/6) / [1 + (0.492/Pr)^(9/16)]^(8/27)}² Laminar-only form (better for Ra < 10⁹): Nu_L = 0.68 + 0.670·Ra_L^(1/4) / [1 + (0.492/Pr)^(9/16)]^(4/9)

Horizontal plate

Hot surface up / cold surface down:

  • Nu_L = 0.54·Ra_L^(1/4) for 10⁴ ≤ Ra_L ≤ 10⁷
  • Nu_L = 0.15·Ra_L^(1/3) for 10⁷ ≤ Ra_L ≤ 10¹¹

Hot surface down / cold surface up (stable):

  • Nu_L = 0.27·Ra_L^(1/4) for 10⁵ ≤ Ra_L ≤ 10¹⁰

Characteristic length L_c = A_s/P (area / perimeter).

Horizontal cylinder (Churchill-Chu)

Nu_D = {0.60 + 0.387·Ra_D^(1/6) / [1 + (0.559/Pr)^(9/16)]^(8/27)}² Valid Ra_D < 10¹².

Sphere (Churchill)

Nu_D = 2 + 0.589·Ra_D^(1/4) / [1 + (0.469/Pr)^(9/16)]^(4/9) Range: Ra_D < 10¹¹, Pr ≥ 0.7.

Vertical rectangular enclosure (aspect H/L)

Berkovsky-Polevikov correlations (cold wall T_c, hot wall T_h, L horizontal gap):

  • For 2 < H/L < 10, Pr < 10⁵, Ra·Pr/(0.2+Pr) > 10³: Nu_L = 0.22·(Ra·Pr/(0.2+Pr))^0.28·(H/L)^(-1/4)
  • For 1 < H/L < 2, 10⁻³ < Pr < 10⁵, Ra·Pr/(0.2+Pr) > 10³: Nu_L = 0.18·(Ra·Pr/(0.2+Pr))^0.29

Horizontal enclosure (Rayleigh-Bénard)

  • Conduction only if Ra < 1708.
  • Turbulent (Globe-Dropkin): Nu_L = 0.069·Ra_L^(1/3)·Pr^0.074, 3×10⁵ < Ra_L < 7×10⁹.

Concentric cylinders / spheres

Raithby-Hollands effective-conductivity formulation k_eff/k = 0.386·(Pr/(0.861+Pr))^(1/4)·Ra*^(1/4) with a modified Ra*.


6. Boiling — pool and flow

Pool-boiling curve (Nukiyama)

ΔT_e = T_s - T_sat. Four regimes:

  1. Free convection ΔT_e < ~5 K (water at 1 atm): natural-convection correlations.
  2. Nucleate boiling 5 < ΔT_e < ~30 K: bubble nucleation at cavities; q” rises ~ΔT_e³.
  3. Transition 30 < ΔT_e < ~120 K: unstable film patches; q” decreases.
  4. Film boiling ΔT_e > ~120 K: continuous vapor blanket; radiation contributes.

Nucleate pool boiling — Rohsenow (1952)

q”_s = µ_l·h_fg · [g(ρ_l - ρ_v)/σ]^0.5 · [cp_l·ΔT_e / (C_sf·h_fg·Pr_l^n)]³

Surface / fluid comboC_sfn
Water-copper polished0.01301
Water-copper scored0.00681
Water-stainless polished0.01301
Water-brass0.00601
Benzene-chromium0.01011.7
n-Pentane-copper polished0.01541.7
R-134a-copper0.00491.7

Note: n = 1 for water, 1.7 for other liquids. C_sf is empirical; surface preparation matters enormously.

Critical heat flux (CHF / boiling crisis) — Zuber

q”_max = C_cr·h_fg·ρ_v^0.5·[σ·g·(ρ_l - ρ_v)]^(1/4) C_cr = π/24 ≈ 0.131 (Zuber). Lienhard: 0.149 for large flat heaters. Kutateladze: 0.131–0.18 typical.

Water at 1 atm: q”_max ≈ 1.26 MW/m². Industrial designs derate to ~25–50%.

Film boiling — Bromley horizontal cylinder

Nu_D = C·[g·ρ_v·(ρ_l - ρ_v)·h’_fg·D³ / (ν_v·k_v·(T_s - T_sat))]^(1/4) C = 0.62 horizontal cylinder, 0.67 sphere. h’_fg = h_fg + 0.8·cp_v·ΔT_e includes vapor superheat. Add radiation: h_total = h_conv + (3/4)·h_rad (Bromley correction when h_rad < h_conv).

Flow boiling — Chen (1966) superposition

h_tp = h_nb·S + h_cv·F

  • h_cv from Dittus-Boelter with liquid-only Re_l = G(1-x)D/µ_l, then multiplied by enhancement F = f(X_tt) (Martinelli parameter).
  • h_nb from Forster-Zuber, multiplied by suppression S = f(Re_tp).

Kandlikar (1990) maps two regimes (convective-dominated CBD vs nucleate-dominated NBD) using Co and Bo.

Gungor-Winterton, Liu-Winterton are common refinements. Stiel-Thodos for new refrigerants.

Subcooled boiling

Bergles-Rohsenow: q”_total² = q”_conv² + q”_boil² (interpolation between FC and saturated NB).


7. Condensation

Hierarchy: dropwise (h 5–10× higher) → film. Dropwise is hard to sustain industrially without promoter coatings; design assumes film.

Nusselt 1916 film theory (laminar)

Vertical plate, isothermal wall: h̄_L = 0.943·[ρ_l·(ρ_l - ρ_v)·g·h’_fg·k_l³ / (µ_l·(T_sat - T_s)·L)]^(1/4) h’_fg = h_fg + 0.68·cp_l·(T_sat - T_s) (Rohsenow correction for liquid subcooling). Valid Re_δ = 4Γ/µ_l < 30 laminar smooth film, where Γ = ṁ_cond per unit width.

Wavy laminar (30 < Re_δ < 1800): Kutateladze h̄_L = Re_δ·k_l / (1.08·Re_δ^1.22 - 5.2)·(ν_l²/g)^(-1/3). Turbulent film (Re_δ > 1800): Labuntsov h̄_L = Re_δ·k_l / (8750 + 58·Pr_l^(-0.5)·(Re_δ^0.75 - 253))·(ν_l²/g)^(-1/3).

Horizontal tube outside (Nusselt)

h̄_D = 0.729·[ρ_l·(ρ_l - ρ_v)·g·h’_fg·k_l³ / (µ_l·(T_sat - T_s)·D)]^(1/4)

Horizontal tube bank (N tubes vertically stacked)

h̄_N,D = h̄_1,D · N^(-1/4) (Nusselt — film thickening from above). Kern correction h̄_N,D = h̄_1,D · N^(-1/6) for inundation in real bundles.

Sphere

h̄_D = 0.815·[same bracket as horizontal tube with D]^(1/4).

Inside horizontal tubes (in-tube condensation)

Two regimes by vapor velocity:

  • Stratified (low G): Chato — h ≈ 0.555·[same Nusselt bracket].
  • Annular (high G): Cavallini-Zecchin or Shah (1979): Nu = 0.023·Re_l^0.8·Pr_l^0.4 · [(1-x)^0.8 + 3.8·x^0.76·(1-x)^0.04 / p_r^0.38] where x is vapor quality, p_r = p/p_crit.
  • Recent: Cavallini 2006 (refrigerants), Thome flow-regime-based.

Dropwise promoters

Hydrophobic coatings (silane SAM, PTFE, parylene-C, lubricant-infused). Heat flux 5–10× film at same ΔT but long-term durability is the issue — most coatings degrade in hundreds of hours.


8. Fin / extended-surface efficiency

Straight rectangular fin (uniform cross-section)

Fin parameter m = √(h·P / (k·A_c)). For rectangular fin width w, thickness t: m = √(2h·(w+t) / (k·w·t)) ≈ √(2h/(k·t)) for w ≫ t.

Adiabatic tip: η_f = tanh(mL)/(mL). Corrected length L_c = L + t/2 absorbs tip-convection: η_f = tanh(mL_c)/(mL_c).

Pin fin (cylindrical, diameter D)

m = √(4h/(k·D)). Same η_f form with L_c = L + D/4.

Annular (radial) fin

Closed-form involves modified Bessel functions K and I; commonly use Schmidt approximation: η_f = tanh(m·r_2c·φ)/(m·r_2c·φ), φ = (r_2c/r_1 - 1)·[1 + 0.35·ln(r_2c/r_1)] r_2c = r_2 + t/2.

Overall surface efficiency

η_o = 1 - (A_f/A_total)·(1 - η_f) where A_f is total fin surface area, A_total = A_f + A_base. Used to apply to a finned-side h.

Fin selection rules of thumb

  • Fins help when (k·t/h)^0.5 > ~1 (fin Biot small). High-k base, modest h, modest t.
  • Aluminum fins on Cu base for cost; pure-Cu fins for very high heat flux.
  • Pin fins shed boundary-layer better in cross-flow but pressure drop higher.
  • Louvered and offset-strip fins increase j by repeated boundary-layer restart at penalty of f.

9. Compact heat exchangers

Area density α > 700 m²/m³ (gas) or > 400 m²/m³ (liquid). Built up of fins between flat plates (plate-fin), tubes with fins (tube-fin), or chemically etched plates (PCHE).

Kays-London j-Colburn factors

For each surface (continuous-flat, louvered, wavy, offset-strip, perforated, pin) the curves j = St·Pr^(2/3) vs Re_Dh and Fanning f vs Re_Dh are tabulated.

Surfacej relativef relativeNotes
Plain flat1.01.0baseline
Wavy1.5–2.01.5–2.0low-cost enhancement
Louvered2–32–3auto radiators/condensers, R-134a/R-1234yf
Offset-strip (OSF)3–43–4aerospace, cryogenic
Perforated1.51.5obsolete-ish
Pin fin3+4+very high f penalty

NTU-ε effectiveness method

Definitions:

  • C_min = (ṁ·cp)_min, C_max = (ṁ·cp)_max, C_r = C_min/C_max.
  • NTU = UA/C_min.
  • ε = Q_actual / Q_max, Q_max = C_min·(T_h,i - T_c,i).

Closed-form ε for common flows:

  • Counterflow: ε = [1 - exp(-NTU·(1-C_r))] / [1 - C_r·exp(-NTU·(1-C_r))]; C_r = 1 → ε = NTU/(1+NTU).
  • Parallel: ε = [1 - exp(-NTU·(1+C_r))] / (1+C_r).
  • Cross-flow both unmixed: ε ≈ 1 - exp[(NTU^0.22/C_r)·(exp(-C_r·NTU^0.78) - 1)] (Eckert).
  • Cross-flow one mixed: ε = (1/C_r)·{1 - exp[-C_r·(1 - exp(-NTU))]}.
  • Shell-and-tube (1 shell, 2N tube passes): TEMA formula with E = √(1+C_r²).
  • Boiler/condenser (C_r = 0): ε = 1 - exp(-NTU).

Multipass and TEMA designations

TEMA shell types: E (single-pass, most common), F (two-pass longitudinal baffle), J (divided flow), K (kettle reboiler), X (cross-flow). Heads: A (channel + cover), B (bonnet), C (channel integral), N (channel integral fixed tubesheet). Rear: L (fixed), M (fixed bonnet), N (fixed), P (outside-packed floating), S (split-ring floating), T (pull-through), U (U-tube), W (packed floating).


10. Heat-exchanger types — selection map

TypeVendors / standardsUsePressureTemp range
Shell-and-tube TEMAAlfa Laval, Kelvion, Koch, Smithcorefining, petrochem, steam<300 bar-200 to 800°C
Plate-and-frame gasketedAlfa Laval (M-series), GEA Sondex, SWEPHVAC, food, dairy<25 bar-40 to 200°C (gasket)
Brazed plate (BPHE)SWEP, DanFoss, Kelvion, Alfa Laval CBsmall refrig, HP, EV battery<50 bar-195 to 225°C
Welded plate (semi-welded)Alfa Laval AlfaRex, GEA Bloc, Compablocaggressive media<40 bar-50 to 350°C
Printed-circuit (PCHE)Heatric (Meggitt), Vacuum Process, Alfa Laval DCsCO₂, LNG, hydrogen<600 bar-200 to 900°C
Plate-fin (PFHE, brazed Al)Linde, Chart Industries, Kobe Steel, FIVEScryogenic (LNG, ASU)<120 bar-270 to 65°C (Al)
SpiralAlfa Laval, Kelvionfouling slurries, sludges<25 barup to 400°C
Double-pipe (hairpin)Brown Fintube, Kochsmall duties, viscous<100 bar-100 to 600°C
Finned-tube air cooler (ACHE)Hudson (SPX), Harsco, Wabashrefinery cooling, HVAC outdoor<300 bar (tubes)up to 400°C
Coil-wound (CWHE)Linde, Air Products, IHIbase-load LNG<100 bar-200°C
Bayonetcustomreformers, low-ΔThighhigh
Falling-film evaporatorGEA Wiegand, SPX Anhydro, Alfa Laval AlfaVapfood, dairy, juicelow<120°C

PCHE for sCO₂ Brayton (10–25 MPa, 500–700°C): Heatric Inconel 617 / 800H diffusion-bonded.


11. Contact resistance — TIMs

Bond-line thermal resistance R”_bond = t_BL/k_TIM + R”_c1 + R”_c2 (top + bottom contact). Typical chip-to-heatsink stack: 0.05–0.5 K·cm²/W.

TIM classExamplesk (W/m·K)FormNotes
GreasesArctic Silver 5, Thermal Grizzly Kryonaut, ShinEtsu G-7513–12pastepump-out over thermal cycles
Phase-change pads (PCM)Honeywell PTM7950, Henkel Bergquist Hi-Flow 650P5–8solid → softLCD/laptop, very stable
Silicone gelDow TC-3022, Henkel SS-17001–3curedstructural, no pump-out
Silicone padBergquist Sil-Pad, Laird Tflex1–6sheeteasy assembly, thicker bond-line
Graphite sheetPanasonic PGS Pyrolytic, Henkel BRTS-1, GrafTech eGraf SS600–1900 (in-plane!)sheetanisotropic — high in-plane only
Indium foil / metallizedIndium 5.7, Hi-Tech HTP-10086solderedspace, defense, high-flux
Liquid metalGalinstan, Thermal Grizzly Conductonaut70–80liquidAl-corrosive; do not use on Al lid
Solder TIMindium-based, SnBi50–90reflowedhardest to assemble, lowest R
Carbon nanotube padsCarbice, Cambridge Nanomaterials30+dry adhesivespace/defense

Roughness-cleared joint conductance: h_c = function of P_contact / H_micro (microhardness), surface roughness σ, and λ (mean-plane slope). Yovanovich correlations.


12. Radiation

Stefan-Boltzmann

Black surface emission: E_b = σ·T⁴, σ = 5.670374×10⁻⁸ W/(m²·K⁴). Gray surface: q = ε·σ·(T_s⁴ - T_surr⁴), 0 < ε < 1.

View factors F_{ij}

F_{ij} = fraction of radiation leaving surface i striking surface j directly. Reciprocity: A_i·F_{ij} = A_j·F_{ji}. Summation: Σ_j F_{ij} = 1 for enclosure. Tabulated formulas for parallel rectangles, aligned squares, coaxial disks, perpendicular rectangles with a common edge.

Radiosity network

For a gray-diffuse N-surface enclosure: solve N equations (E_bi - J_i)/((1-ε_i)/(ε_i·A_i)) = Σ_j (J_i - J_j)/(1/(A_i·F_{ij})) for radiosity J_i, then q_i = (E_bi - J_i)/((1-ε_i)/(ε_i·A_i)).

Combined h (parallel convection + radiation)

For surface losing to surroundings at near-ambient: define radiation h_rad such that q_rad = h_rad·(T_s - T_surr), h_rad = ε·σ·(T_s + T_surr)·(T_s² + T_surr²) Total h_total = h_conv + h_rad. Useful in natural-convection electronics enclosures where h_rad often equals or exceeds h_conv.

Gas radiation (participating media)

CO₂ and H₂O in combustion products absorb/emit on bands. Hottel charts give ε_g(p_g·L, T_g) with overlap correction Δε for mixtures. WSGGM (Weighted Sum of Gray Gases) for CFD. Soot dominates in flames.

Selective surfaces

Solar absorber: high α_solar (0.3–2.5 µm), low ε_thermal (>2.5 µm). Black chrome, TiNOX, sputtered cermet. ε/α ratio drives Concentrating Solar plant efficiency.


13. Transient lumped capacitance

Valid when Bi = h·L_c/k_body < 0.1 (L_c = V/A — internal gradient negligible).

T(t) = T_∞ + (T_i - T_∞)·exp(-t/τ), τ = ρ·V·cp / (h·A) = (Bi·Fo)⁻¹·(L_c/α)… rewriting: T(t) - T_∞ / (T_i - T_∞) = exp(-Bi·Fo)

For Bi > 0.1: solve 1D Heisler charts (slab, cylinder, sphere). Series solution θ*= Σ C_n·exp(-ζ_n²·Fo)·f_n(r*) with eigenvalues ζ_n from transcendental equation. First-term approximation valid for Fo > 0.2.

Semi-infinite solid (sudden surface T_s): θ/θ_i = erf(x/(2√(αt))) for constant surface T.


14. Heat pipes and vapor chambers

Closed evacuated tube with wick. Working fluid evaporates at hot end, vapor flows to cold end, condenses, capillary returns through wick. Effective k_eff = 10⁴–5×10⁴ W/m·K — orders of magnitude above solid Cu.

Operating limits (whichever is smallest sets q_max)

  1. Capillary limit — wick can’t return liquid fast enough; 2σ/r_c ≥ ΔP_l + ΔP_v + ΔP_g.
  2. Boiling limit — nucleate boiling inside wick disrupts capillary action.
  3. Sonic limit — vapor flow chokes at exit of evaporator (low-pressure startup, alkali metal).
  4. Entrainment limit — high vapor velocity shears liquid off wick surface (Weber number criterion).
  5. Viscous limit — at very low T, vapor viscous ΔP dominates (cryogenic).

Working fluid by temperature range

RangeFluidApplication
4–77 KHe, H₂cryogenic
60–200 KN₂, Ne, O₂cryogenic
230–400 KNH₃, methanol, acetone, R-134aelectronics, satellites
280–500 KwaterCPU, GPU, server
400–650 Ktoluene, naphthalene, Dowthermindustrial
550–1100 Kmercury, cesium, potassiumnuclear, space power
1100–2300 Ksodium, lithium, silverreactor, leading edge

Wick types

Sintered powder (best capillarity, isotropic), groove (axial, high q but low gravity tolerance), mesh screen (cheap, planar), composite (powder + groove), arteries (high-power axial).

Vendors

Aavid Genie/Boyd, ACT Advanced Cooling Technologies, Cooler Master, Wakefield-Vette, Furukawa Electric, Fujikura, Sunon. Vapor chambers for CPU/GPU spreaders: AMECTHERM, Coolerage, Asia Vital Components.


15. Useful property reference (engineering quick-look)

Thermal conductivity k (W/m·K) at ~25°C

Materialk
Diamond2200
Silver429
Copper (OFHC)401
Gold317
Aluminum 6061167
Aluminum 1100222
Brass C26000120
Carbon steel 101851
Cast iron, gray52
Stainless 30416
Stainless 31614
Inconel 60015
Ti-6Al-4V6.7
Alumina 96%24
AlN170
BeO250
Si single crystal148
Macor machinable ceramic1.5
Pyrex1.4
FR-4 (in-plane)0.30
FR-4 (through)0.29
PTFE0.25
PEEK0.25
Polyimide (Kapton)0.12
Air (1 atm)0.026
Water (liquid)0.61
Engine oil SAE 500.145
Ethylene glycol0.252
50/50 EG-water0.40
R-134a liquid0.083
R-410A liquid0.090
Glass wool insulation0.045
PU foam closed-cell0.025
Aerogel0.014

Prandtl number Pr at 25°C

FluidPr
Mercury0.025
Sodium (400°C)0.005
Helium0.69
Air0.71
Water6.13
Ammonia1.6
R-134a3.5
Ethylene glycol150
50/50 EG-water30
Engine oil SAE 508500
Glycerin12500

Coefficient of thermal expansion β (1/K) at 25°C

  • Ideal gas: β = 1/T(K) ≈ 0.00335 at 25°C.
  • Water: 0.000257.
  • Ethylene glycol: 0.00065.
  • Engine oil: 0.0007.

16. Selection heuristics — match the application

ApplicationRecommended thermal solution
Handheld phone / wearable SoCembedded heat pipe + graphite spreader (PGS) + chassis as heat sink
Laptop CPU/GPUheat pipes + vapor chamber + axial fan + perforated fin stack
Data-center CPU cold-plateCu cold plate (skived/microchannel) + EG-water + plate-and-frame CDU + dry cooler outside
EV battery pack (NMC pouch)brazed Al cold plate beneath modules + glycol-water 50/50
EV power electronics (SiC inverter)pin-fin baseplate over EG-water; some Tier-1 going to direct two-phase
Server PSU / DC-DCextruded Al fin + axial fan; or AlSiC IMS PCB if dense
LED high-bayextruded Al fin + natural convection; high-end uses heat pipes
HVAC residential outdoor coillouvered-fin tube-and-fin condenser, Al fins on Cu tubes, axial fan
HVAC residential indoor coilCu hairpin + Al wavy/lanced fins, evaporator
HVAC commercial chiller condensershell-and-tube smooth or low-fin Cu, water-cooled
Refrigeration commercial evap (R-744 CO₂)microchannel Al, brazed
Automotive radiatorAl brazed louvered, single-row tube
Automotive AC condenser (R-1234yf)multi-pass microchannel parallel-flow Al
Automotive AC evaporatorlaminated Al plate (B-type) + louvered fin
Cryogenic LNG main-cryogenic exchangercoil-wound (Linde, AP) or plate-fin brazed Al (Chart, Linde)
LNG vaporizer (regas)shell-and-tube SS or open-rack seawater
Air separation cold boxplate-fin brazed Al Linde/Chart
sCO₂ Brayton recuperatorPCHE Heatric Inconel 617 / 800H
Nuclear steam generator (PWR)inverted U-tube shell-and-tube Inconel 690
Concentrating solar receivertube-and-fin or PCHE, NaK or molten salt or sCO₂
Refinery preheat trainshell-and-tube TEMA AES/AET, large duties
Food/dairy pasteurizerplate-and-frame gasketed (clean-in-place)
Pharma evaporatorfalling-film evaporator, GEA Wiegand
Turbine blade internal coolingimpingement + rib-roughened + pin-fin trailing edge + film holes on leading edge
Combustor linereffusion cooling + transpiration + thermal-barrier coating

17. Cross-references


18. Citations

  • Incropera, DeWitt, Bergman, Lavine — Fundamentals of Heat and Mass Transfer, 8th ed (Wiley 2019). Standard university reference; correlation tables in Ch. 7–10.
  • Kays & Crawford — Convective Heat and Mass Transfer, 4th ed (McGraw-Hill 2005). Authoritative on internal flow and variable-property effects.
  • Kays & London — Compact Heat Exchangers, 3rd ed (Krieger 1984). The j and f data for compact surfaces.
  • Çengel & Ghajar — Heat and Mass Transfer: Fundamentals and Applications, 6th ed (McGraw-Hill 2020). Practical engineering presentation.
  • Shah & Sekulic — Fundamentals of Heat Exchanger Design (Wiley 2003). Industry HX design methodology.
  • Carey — Liquid-Vapor Phase-Change Phenomena, 2nd ed (Taylor & Francis 2008). Definitive boiling/condensation theory.
  • Thome — Engineering Data Book III (Wolverine 2010). In-tube boiling/condensation correlations.
  • Hewitt et al. — Process Heat Transfer (CRC 1994). Industrial perspective, foulling and TEMA.
  • Faghri — Heat Pipe Science and Technology (Taylor & Francis 1995). Heat-pipe design.
  • ASHRAE Handbook — Fundamentals (2021), HVAC Systems and Equipment (2024). HVAC HX selection.
  • ESDU correlation library — proprietary but the industrial gold standard.
  • Thermopedia — online correlation reference (Begell House). https://www.thermopedia.com/
  • ASME PTC 12.5 — single-phase HX performance test code.

Note: All correlations have ranges of validity. Out-of-range extrapolation is the dominant source of design error. When in doubt, run a CFD check (RANS k-ω SST for single-phase, VOF or Eulerian for two-phase) and validate against the nearest in-range correlation.