Passive Components — Family Index
Three-pillar family index for the linear passives that dominate every PCB BOM: resistors (R, ohms), capacitors (C, farads), inductors (L, henries). Each pillar splits into a handful of construction technologies that trade off accuracy, temperature drift, frequency response, voltage / current / power handling, package size and unit cost. Active devices and electromechanical components are out of scope (see cross-references).
1. At a glance
| Pillar | SI unit | Defining equation | Core construction families |
|---|---|---|---|
| Resistor | ohm Ω | V = IR | thick-film SMD, thin-film SMD, bulk-metal foil, wirewound, current-sense shunt, HV / power, sensor-type (NTC/PTC/RTD/LDR/strain) |
| Capacitor | farad F | i = C dV/dt | MLCC ceramic (Class I / Class II), film (PP/PET/PEN/PPS), Al-electrolytic, tantalum, polymer-Al hybrid, supercapacitor / EDLC, mica, vacuum / HV |
| Inductor | henry H | v = L di/dt | wirewound chip, multilayer chip, RF air-core, through-hole power (toroid / drum), planar, common-mode choke, transformer / coupled inductor |
The trade-spaces inside each pillar are different. For resistors it’s accuracy × power × noise × frequency. For capacitors it’s CV-product per volume × loss tangent × voltage / DC-bias coefficient × temperature × lifetime. For inductors it’s saturation current × DC-resistance × Q × self-resonant frequency × core loss at the switching ripple frequency. There is no universal “best” — every design picks a construction per node based on which trade is binding there.
2. Resistor — thick-film SMD chip
The everyday R that lands on every consumer / industrial board by the hundred. Construction: alumina substrate, screen-printed RuO₂ / TaN paste, laser-trimmed, terminated with Ni-barrier + Sn-finish.
Standard EIA package codes (imperial / metric):
| Code | Imperial L×W (mil) | Metric L×W (mm) | Power std |
|---|---|---|---|
| 01005 | 16×8 | 0.4×0.2 | 1/32 W |
| 0201 | 24×12 | 0.6×0.3 | 1/20 W |
| 0402 | 40×20 | 1.0×0.5 | 1/16 W |
| 0603 | 60×30 | 1.6×0.8 | 1/10 W |
| 0805 | 80×50 | 2.0×1.25 | 1/8 W |
| 1206 | 120×60 | 3.2×1.6 | 1/4 W |
| 2010 | 200×100 | 5.0×2.5 | 1/2 W |
| 2512 | 250×125 | 6.4×3.2 | 1 W |
Specs: tolerance E96 ±1 % standard (E24 ±5 % legacy for jellybean values); TCR ±100…±200 ppm/°C; rated voltage 50 V (0402) to 200 V (2512); noise ~−20 to +10 dB (poor — film granularity). Vendors: Yageo RC-series, Panasonic ERJ, Vishay CRCW, Rohm MCR, KOA RK73B, Stackpole RMCF. Used everywhere there is no precision or low-noise requirement.
3. Resistor — thin-film SMD chip
Precision tier. Sputter-deposited NiCr / TaN film, photolithographic patterning, laser trim. TCR ±5…±25 ppm/°C, tolerance to ±0.01 % (1 part per 10⁴), 1/f current noise 10-30 dB lower than thick-film. Same SMD chip footprints (0402–2512).
Vendors: Vishay TNPV / TNPW e3 / PNM, Susumu RG / RR-series, Panasonic ERA, Yageo RT, Rohm MCT06, Bourns CHP-T. Used in instrumentation amplifiers, A/D and D/A reference dividers, audio gain stages, sensor bridges, and anywhere drift over temperature would dominate the error budget.
Resistor networks / arrays — laser-matched ratio drift of ±0.5 ppm/°C between elements is the key spec, e.g. Vishay MORN, Susumu RM3216 array, IRC RPSM.
4. Resistor — bulk-metal foil
Metrology-grade. A foil of Ni-Cr alloy bonded to a ceramic substrate; the geometric pattern is photo-etched. The mechanical stress of TC expansion is opposed by the foil’s piezoresistive coefficient — net TCR drops to 0.05 ppm/°C, tolerance is offered to ±0.005 %, long-term drift < 2 ppm / year.
Vendors: Vishay / Foil Resistors VHP / VPR / VHA / Y-series, Caddock USF, Alpha Electronics MC-series. Used in standards labs, ATE (automatic test equipment), 6½/7½-digit DMMs, medical strain-gauge front ends. Order of magnitude more expensive than thin-film; physically larger (axial-leaded molded packages, or hermetic).
5. Resistor — wirewound
High-power tier. Resistance wire (NiCr, Manganin, Constantan) wound on ceramic or vitreous-enameled bobbin, optionally potted in aluminum-housed heatsink shell. Power 1–100 W axial / cement-block, 100–1000 W in heatsink-mountable chassis-style.
Vendors: Vishay Dale RH / RS / NH, Ohmite (Brown Devil B-series, 200-series axial, TF-series chassis), Welwyn / TT WH, Caddock MP-series (flat-pack power), Vitrohm. Inherent drawback — significant series inductance (10s of µH for a typical 50 W wirewound) makes it useless above audio frequencies. Bifilar / Ayrton-Perry-wound non-inductive variants exist (e.g. Vishay NS-series, Ohmite WNE Non-Inductive) trading larger size for L < 100 nH.
6. Resistor — current-sense shunts
Low-Ω (0.1 mΩ – 1 Ω) with 4-terminal Kelvin sense pads, optimized for low TCR + low parasitic L at high current. Construction: thick-film, thin-film, or bulk-metal-foil resistive element on copper substrate; some are pure metal-strip (Manganin / Zeranin / Ni-Cu) wedge between two copper terminations.
Vendors / families:
- Vishay WSL / WSLP / WSC / WSHC / WSBM8518 (metal strip), Power Metal Strip®, VCS series.
- Bourns CSS-2010 / CSS-3637 / CSS2H / CHF.
- Susumu HRM / KRL / KRF / PRL high-power.
- Cyntec CSR / OEM Tesla / EV-grade shunts.
- TT Electronics / Welwyn LRMA / OARS-XP.
- Rohm PSR / GMR / UCR.
Footprints: 1206 (1 W), 2010 (1–2 W), 2512 (1–3 W), 5931 / 8518 / 7520 (5–10 W metal strip). TCR ±50…±20 ppm/°C, tolerance ±0.5 % / ±1 %. Used in motor drives, battery management (cell stack + pack current), DC-DC converter inner loops, server power-rail telemetry. Pair with a current-sense amplifier (INA240, MAX9918, AD8418).
7. Resistor — high-voltage / high-power
Specialty constructions for kV-class or kW-class loads. Power-flat-pack thick-film on AlN substrate (Caddock MP9000 / MP930 / MP850 / MP820 — 30–250 W with TO-220 / TO-247 form), high-V thick-film glaze on glass-encapsulated rods (Ohmite TGHG, MOX, Caddock USF-300, Vishay CHV2512 / HVR series up to 50 kV), and “TO-247-package” planar power resistors (Vishay LTO 030 / LTO 050 / LTO 100).
Applications: dynamic braking for VFDs, snubber networks on IGBT/SiC modules, HV power-supply dividers, X-ray / mass-spec / CT-scan tube biasing, electric-fence pulse generators. Voltage de-rating per IPC-2221 — for >100 V, derate to ≤80 % of rated working voltage; mind clearance / creepage for HV.
8. Resistor — sensor-type
Resistors with strong, repeatable, exploited dependence on a non-electrical variable.
- NTC thermistors — sintered Mn-Ni-Co-Fe oxides, R(T) = R₂₅ · exp(B · (1/T − 1/298)). Typical 10 kΩ @ 25 °C, B-constant 3380 K. Examples: Murata NCP15WF104, TDK B57550G, Vishay NTCS, EPCOS B57164. Used for temp sense (battery packs, MCU thermal protection), inrush limiting (e.g. Ametherm SL22 in series with AC mains rectifier — cold resistance limits surge, self-heats and drops).
- PTC thermistors — BaTiO₃-based (sharp Curie-point switching ~ 60–150 °C — Murata PRG, EPCOS B59001) or polymer-PPTC self-resetting fuses (Bourns MF-R, Littelfuse PolySwitch, TE Raychem RUE/RXEF, Belfuse 0ZCF). Solid-state replacement for slow-blow fuses on USB and battery lines.
- Silistor — Si-bulk PTC, near-linear positive TCR ~ +0.7 %/°C.
- RTD (Pt100 / Pt1000) — thin-film platinum element on alumina, IEC 60751 curve. Heraeus M-FK / W-EYK, Honeywell HEL-700-T-0, IST P-series, OMEGA F2020. ±0.1 °C (Class A) / ±0.3 °C (Class B) accuracy; 4-wire Kelvin connection at 0.1 °C resolution.
- Photoresistor (LDR) — CdS photoconductive cell (Excelitas / Advanced Photonix VT-series, GL5528) — declining, RoHS-restricted (Cd), being replaced by photodiode + TIA.
- Strain gauges — foil-type metal-grid bonded to substrate, GF ~2. Micro-Measurements (Vishay Precision Group) EA / CEA / WK series, HBM 1-LY series, KYOWA KFGS. Wheatstone-bridge front-end (e.g. AD8237, HX711).
9. Capacitor — MLCC (multi-layer ceramic chip capacitor)
Workhorse of every modern PCB. Stacked alternating Ni / Cu electrode layers separated by sintered ceramic dielectric (BaTiO₃ or doped variants for Class II; CaZrO₃ / NP0-formulations for Class I). Terminations Ni-barrier + Sn finish, optional flex-tolerant termination (Open-Mode, Soft-Term, Flex-Sense).
EIA temperature classes (EIA-RS-198):
| Class | Code | Behavior | Tol over Trange | Use |
|---|---|---|---|---|
| I | C0G / NP0 | linear, low loss | ±0 ppm/°C, ±30 ppm | RF tuned circuits, PLLs, filters, sample-hold |
| I | U2J / P90 | linear | −750 ppm/°C | RF temp comp |
| II | X7R | T-dependent | ±15 % over −55…+125 °C | bulk decoupling |
| II | X5R | T-dependent | ±15 % over −55…+85 °C | mobile bulk decoupling |
| II | X8R | high-temp | ±15 % over −55…+150 °C | automotive |
| II | Y5V | very lossy | +22 / −82 % over −30…+85 °C | bulk only, non-critical |
| III | Z5U | similar to Y5V | +22 / −56 % over +10…+85 °C | legacy |
Class I (C0G / NP0) capacitors are made from paraelectric formulations, εr ~ 30–80, low loss tangent (Df < 0.001 across freq), Q > 10 000 at 1 MHz — but small capacitance per volume (max ~ 220 nF in 0805). Class II (X7R, Y5V) uses ferroelectric BaTiO₃, εr 2000–18000 — high CV density but lossy and strongly voltage-dependent.
The DC-bias problem — A nominally 10 µF / 25 V X7R MLCC in 0805 might exhibit 4–6 µF at 10 V DC bias and < 1 µF at 25 V. Y5V is worse. Always pull the manufacturer’s C-vs-Vdc curve when sizing decoupling and DC-DC output caps. C0G is bias-flat.
Sizes 01005 (0.4×0.2 mm) → 2225 (5.7×6.3 mm). Voltage ratings 4 V to 6.3 kV.
Vendors: Murata GRM / GCM (auto) / GJM (RF) / GR3 (high cap), TDK CGA (auto) / C-series, Samsung Electro-Mechanics CL-series, Yageo (acquired Kemet 2020) CC / KGM / C-series, Taiyo Yuden GMK / EMK / UMK / TMK, Walsin 0402N1H, Kyocera-AVX (now Kyocera) CX-series, Murata’s KRM / KGM safety subline.
10. Capacitor — film
Self-healing, low-loss, the audio + EMI + EV-inverter DC-link choice. Construction: thin polymer film (1–20 µm), metallized on one side (Zn or Al, ~10–50 nm), wound or stacked between extended-foil terminations, encapsulated.
| Dielectric | Df @ 1 kHz | Max Trange | Typical use |
|---|---|---|---|
| PP (polypropylene) | 0.0003–0.0005 | −55…+105 °C | DC-link inverter caps (EV / PV), audio, snubbers |
| PET (polyester / Mylar) | 0.005 | −55…+125 °C | general signal-bypass |
| PEN (polyethylene naphthalate) | 0.005 | −55…+150 °C | hot apps replacing PET |
| PPS (polyphenylene sulfide) | 0.0006 | −55…+150 °C | high-stab timing circuits |
| PTFE | 0.0002 | −55…+200 °C | RF + military |
| PC (polycarbonate) | 0.001 | discontinued post-2000 | legacy |
Vendors: Vishay BCcomponents MKT / MKP / Roederstein, KEMET F862 X2 / R46 / R75 / R76, Wima MKS / FKS / MKP / FKP / DC-Link, EPCOS / TDK B32 / B32xxx series (EV inverter DC-link a specialty), Panasonic ECW-F / ECQ-U, Murata DEHR / DECx-X2, Cornell Dubilier 940C / 947D.
Safety capacitors for AC line — IEC 60384-14 / UL 60384-14, X-class (across-line, failure → short safe), Y-class (line-to-ground, failure must open). X1 = pulse-rated, X2 = standard mains line filtering, Y1 / Y2 across reinforced insulation. Common P/Ns: Vishay F1772, KEMET R46 (X2), R75 (Y2); Wima MP3X2 / MP3Y2; Murata KRM (Y2).
11. Capacitor — electrolytic
The bulk-energy storage tier. Polar — anode is a thin Al or Ta oxide layer grown electrolytically on a roughened foil (huge effective surface area), cathode is a liquid or solid electrolyte. Polarity-sensitive, finite life (Arrhenius — life halves per 10 °C).
Aluminum electrolytic — radial leaded (Nichicon UPW / PW, Rubycon ZL / YXJ, Nippon Chemi-Con KZE / KY, Panasonic FR / FM), SMD V-chip (Nichicon UCJ, Panasonic EEEFK), snap-in (Rubycon BXC, NCC LXY, Vishay 256), screw-terminal (KEMET PEH200, EPCOS B43630). Range 0.1 µF–470 mF, 6.3 V–500 V (electrolytic) or 600 V (snap-in). Temp grades 85 °C / 105 °C / 125 °C / 135 °C. ESR 10–500 mΩ.
Tantalum — solid Ta anode + MnO₂ cathode (KEMET T491 / T494 / T520, AVX TAJ / TPS / KO-CAP, Vishay 595D / TR3 / 597D), or polymer-Ta with conductive polymer cathode for lower ESR (KEMET T520 / T521, AVX TLJ / TPM). Range 0.1 µF–680 µF, 2.5 V–63 V. Caution: solid-Ta failure mode is short → ignition under in-rush; always de-rate to 50 % of V-rated, or use polymer-Ta which fails-open.
Niobium-oxide — AVX OxiCap — Nb₂O₅ anode, MnO₂ cathode; intrinsically safer fail-open mode than solid-Ta. Slightly higher ESR.
Polymer aluminum / hybrid — solid conductive polymer cathode + Al anode, no liquid electrolyte — long life (>10 000 h @ 105 °C), low ESR (3–30 mΩ), but lower V (typ ≤ 100 V). Examples: KEMET A700 / A750, Panasonic OS-CON SVPF / SVPS, Nichicon NWPHC / PCV, Rubycon PX series. Hybrid types (liquid + polymer cathode — Nichicon HW / HZ) extend voltage range to 100 V with low ESR.
12. Capacitor — supercapacitor / EDLC
Electrochemical double-layer capacitor. Activated-carbon electrodes (huge specific surface 1000–3000 m²/g) + organic electrolyte; faradaic-pseudocapacitance hybrids extend energy density. Energy 5–10 Wh/kg (≈ 1/30 lithium), power 5–10 kW/kg (≈ 10× lithium). Voltage 2.5–3.0 V per cell (organic electrolyte breakdown), stacked + balanced for higher V.
Vendors: Maxwell Technologies BCAP / DuraBlue (Tesla-owned), Eaton XL60 / HV / TV, Skeleton Technologies (graphene), Cap-XX prismatic, Murata DMF / DMT / DSF (3.8 V Li-ion-cap hybrids), KEMET FT0H / FE / FG, Vishay 225 EDLC-HVR / 196 HVC series, Nichicon EV series. Applications: regen energy storage / KERS, UPS DC-link hold-up, pulse loads (cellular base-station TX bursts, automotive starter), short-term backup for SSDs (e.g. AGIGA Tech AGIGARAM modules).
13. Capacitor — mica / silver-mica
Natural-mica dielectric (muscovite, εr ~ 7) with silver electrodes deposited or foil-clamped. Q > 1000 @ 1 MHz, sub-1 % tolerance, ultra-stable (TC ±50 ppm/°C). Range typically 1 pF–10 nF, voltage to 1 kV.
Vendors: Cornell Dubilier CD15CD / CDV30 / MD / MC, AVX MQ-series (Kyocera-AVX), Vishay MIL-spec CM-series, Simic Electronics. Applications: HF/VHF transmitters, military radio, precision oscillator-loop capacitors, electrometer front ends. Now niche — C0G / NP0 ceramic and PP film cover most use cases at lower cost.
14. Capacitor — vacuum / high-voltage
Two coaxial copper electrodes in evacuated glass or ceramic envelope, either fixed or motor-tunable. Voltage ratings 5–60 kV, capacitance 5 pF–5000 pF. Vendors: Comet (CV series), Jennings Technology (UCSL, CVCD, CVDD), Meiden, GD-PT.
Applications: PA tank-circuit matching for 1–30 MHz commercial-broadcast and amateur kilowatt transmitters, semiconductor-fab RF plasma matching networks (13.56 MHz, 27 MHz), particle-accelerator RF cavities, MRI gradient coils. Tunable-vacuum cap drives are precision-stepper-controlled.
15. Inductor — wirewound (chip)
Insulated copper wire wound on a ceramic / ferrite drum or composite-core slug, terminated with metal end-caps, optionally shielded.
Small-signal RF chips — 0402 / 0603 / 0805 / 1008 wire-around-ceramic: TDK MLF, Murata LQW / LQH / LQG, Coilcraft 0805CS / 0805HS / 0603CS, Würth WE-RFI. Inductance 1 nH–10 µH, Q 30–60 at 100 MHz, SRF GHz-region.
SMD power inductors (composite-core) — flat-wire wound in a pressed iron-powder + polymer composite block, magnetically shielded; soft saturation curve. Examples: Vishay IHLP / IHLE, Coilcraft XAL / XEL / XGL, Würth WE-XHMI / WE-LHMI / WE-MAPI / WE-HCI, Bourns SRR / SRP / SRN, TDK SPM, Taiyo Yuden NR / MCKK / MCOIL, Pulse PA45 / P15-series. Inductance 0.1 µH–100 µH, Isat 0.5 A–50 A, DCR 0.5 mΩ–500 mΩ. Used in switching-regulator output stages (typ 3.3 µH–22 µH for buck output at 1–4 MHz; smaller as switching frequency rises).
16. Inductor — multilayer chip
Co-fired ceramic green-sheet stack with screen-printed Ag-paste spiral windings; cured into a monolithic block. No discrete wire — tiny (down to 0201 / 01005) and cheap. Lower Q (10–30) than wirewound but adequate for many bypass / matching applications.
Vendors / families: TDK MLG / MLK, Murata LQM / LQG / LQP, Taiyo Yuden HK / MAKK / MEKK, Yageo CL series. Application: RF impedance matching, signal-line decoupling, antenna tuning.
17. Inductor — RF air-core / chokes
For Q > 100 in the HF–VHF region, air-cored (no magnetic core, no saturation, no T-drift) winding is preferred. Mini-spring inductors (Coilcraft Mini-Spring, B / A / Q series), ATC RFC, machined / molded ceramic-core RF chokes (Coilcraft 1008CS / 1812CS), Würth WE-KI variants.
Ferrite beads / common-mode chokes for EMI suppression — high-impedance lossy elements (R(f) is the working spec, not L(f)). MnZn ferrite for <100 MHz, NiZn for 100 MHz–GHz. Murata BLM / DLW / NFM, TDK MMZ / MPZ / ACM / ACT, Würth WE-CBF / WE-CNSW, Coilcraft 0805PS, Sunlord SDFL. Used for shunting common-mode noise on USB / HDMI / Ethernet / power-supply input lines.
18. Inductor — through-hole power
Higher I, higher V, lower cost-per-µH at >1 A levels.
Toroid + radial-leaded toroid (Bourns RLB / 5400-RC, Coilcraft RFB, Pulse PE / PA / PM, Würth WE-TI). Gapped-ferrite SMPS cores in standard core shapes: E / EE / EFD / EER / EI / RM / PQ / ETD / U / pot-core / planar-EE. MnZn material 3C90 / 3C94 / 3C95 / N87 / N97 / PC44 / PC95 (Ferroxcube, Magnetics, TDK, Hitachi) for SMPS at ≤ 500 kHz, NiZn material 4F1 / 67 / 61 / 43 for RF / EMI work. Custom-wound transformers ride on these same cores.
19. Magnetic core materials
| Family | Typ. μᵢ | Sat flux Bs | Loss / freq sweet-spot | Use |
|---|---|---|---|---|
| MnZn ferrite (3C90 / N87) | 2000–3000 | 0.4–0.5 T | 25–500 kHz | mainstream SMPS |
| MnZn ferrite high-freq (3C95 / N49 / PC95) | 3000 | 0.5 T | 200 kHz–1 MHz | LLC, GaN SMPS |
| NiZn ferrite (4F1 / 67) | 100–700 | 0.3 T | 1–500 MHz | RF, EMI suppression |
| Powder iron / carbonyl iron (-26, -52 mix) | 75–125 | 1.4 T | 50 kHz–500 kHz | distributed gap, soft sat, DC chokes |
| Sendust / KoolMu (Fe-Si-Al) | 26–125 | 1.0 T | 25 kHz–1 MHz | PFC chokes, output chokes |
| High-flux (Fe-Ni 50/50) | 14–160 | 1.5 T | 25 kHz–500 kHz | DC chokes, high DC-bias |
| MPP molypermalloy (Fe-Ni-Mo) | 14–550 | 0.75 T | 50 kHz–1 MHz | lowest loss / smallest size for low-bias |
| Amorphous Co or Fe (Metglas) | 10⁴–10⁵ | 0.5–1.6 T | 1 kHz–100 kHz | common-mode chokes, mag-amp |
| Nanocrystalline (Finemet / Vitroperm) | 10⁵ | 1.2 T | 1 kHz–500 kHz | low-leak common-mode chokes |
| Grain-oriented Si-Fe (M-3, M-4) | 1500–7000 | 2.0 T | 50 / 60 / 400 Hz | line-frequency transformer laminates |
Vendors: Ferroxcube (NXP-divested), TDK (EPCOS / Magnetec), Magnetics Inc. (Spang), Hitachi Metals (Finemet, Metglas), VAC Vacuumschmelze (Vitroperm), Micrometals (powder iron), Carpenter Electrification, Chang Sung CSC.
20. Transformer + coupled inductor
Not strictly a single passive — same lineage as the inductor, but with ≥ 2 windings.
- Common-mode choke (CMC) — two windings same-sense on a high-μ core (typically nanocrystalline or MnZn); blocks CM, passes DM. Examples: Würth WE-CMB / WE-FC, TDK ACM / ACT, Murata DLW. Specified by impedance vs frequency, not L alone.
- Current transformer (CT) — primary is the load current loop (1 turn), secondary is many-turn winding into burden resistor; produces scaled AC representation. Pulse PA10 / PA13, Coilcraft CST series, LEM HX / LF.
- Flyback transformer — gapped ferrite, primary stores energy in core during on-time, releases to secondary during off-time. Würth WE-FBT, Coilcraft RFB / FA / NA / VPH, Eaton CTX, Pulse PA0297. Specified by Lp, turns ratio, peak Ip-sat.
- Forward / push-pull / full-bridge transformer — non-storing, primary energy flows directly to secondary; un-gapped core. Custom or off-shelf Pulse / Würth.
- Planar transformer — copper turns etched into a PCB layer stack, sandwiched between ferrite E-cores. Very low profile + repeatable, common in server / datacenter SMPS. Payton, Pulse PH / PXL, Premo Group.
- Gate-drive transformer — small toroidal isolation for MOSFET / IGBT gate-drive signals; Coilcraft DA / RPC, Pulse PE-68-series, Murata 78250 / 78600.
21. Voltage + safety standards
- IEC 60384-14 (and UL 60384-14) — fixed capacitors for EMI suppression across AC mains (X1/X2/X3, Y1/Y2/Y3/Y4).
- IEC 60938 — fixed inductors for EMI suppression on mains lines.
- IEC 60384 series — general fixed-capacitor sectional specs (e.g. -2 PET film, -8 ceramic Class I, -9 ceramic Class II, -10 ceramic Class III, -16 PP film, -17 plastic film, -22 ceramic SMD).
- IEC 60115 — general resistor sectional specs.
- IEC 60068 — environmental test reference (shock / vib / cycling).
- EIA-RS-198 — ceramic temperature characteristic codes (X7R / Y5V / C0G / NP0 etc.).
- UL 810 — capacitors for ≤ 600 V AC (supercapacitor safety covered).
- AEC-Q200 — automotive passive qualification (humidity, ESD, mechanical-shock matrix that automotive BOM-line items must pass).
- IPC-2221 — generic PCB design rules including HV voltage-derating tables.
22. Tolerance + EIA preferred values
| Series | Tolerance | Decade values |
|---|---|---|
| E6 | ±20 % | 1.0, 1.5, 2.2, 3.3, 4.7, 6.8 |
| E12 | ±10 % | 1.0, 1.2, 1.5, 1.8, 2.2, 2.7, 3.3, 3.9, 4.7, 5.6, 6.8, 8.2 |
| E24 | ±5 % | 1.0–9.1 in 24 logarithmic steps |
| E48 | ±2 % | 48 steps / decade |
| E96 | ±1 % | 96 steps / decade |
| E192 | ±0.5 % | 192 steps / decade |
Values follow 10^(n/N) for N-series. Capacitor values mostly snap to E6 or E12; resistors are E24 for ±5 % thick-film and E96 for ±1 % thick/thin-film, with full E192 in metrology grades.
23. Selection heuristics
| Need | Suggested |
|---|---|
| RF LC tank resonator, low drift | NP0 / C0G MLCC (Murata GJM) + air-core (Coilcraft Mini-Spring) or mica (CD15CD) |
| Bulk decoupling near MCU, mobile | X5R / X7R MLCC bank 0402 + 22 µF X5R 0805 |
| DC-DC output filter, 1–4 MHz | composite-core power inductor (Coilcraft XAL5030) + 22 µF X7R MLCC bank ± polymer-Al hybrid 100 µF (KEMET A700) |
| EV inverter DC-link, 800 V | metallized PP film (EPCOS B32774, KEMET C4D) |
| Mains X-class line filter | KEMET R46 (X2 film) or Vishay F1772 |
| Mains Y-class across reinforced insulation | Murata KRM / DEHR Y2 (safety MLCC) or Wima MP3Y2 |
| Battery pack pulse current sense, 100 A | Vishay WSBM8518 1 mΩ + INA240 current-sense amp |
| Precision 1 kΩ ÷ 1 kΩ divider, 6-digit DMM | Vishay VHP100 bulk-metal-foil pair, ratio TCR 0.05 ppm/°C |
| Flyback 5 W 110 → 12 V isolated | Coilcraft NA-series flyback transformer, gapped MnZn |
| EMI common-mode choke USB 3, low leakage | nanocrystalline / Finemet core CMC (Würth WE-FC), or Murata DLW (NiZn) |
| mm-wave 24 / 60 GHz match | Murata LQG ceramic chip or ATC 600-S Series MLCC |
| Snubber across SiC switch, 1200 V | C4D PP film + low-L film cap or Vishay MKP1840 |
| RTD front-end, ±0.1 °C | Heraeus Pt100 4-wire + thin-film 0.05 % reference resistors (Susumu RG) |
| Inrush limiter on AC bridge | Ametherm SL22 NTC inrush 10 Ω cold |
| Backup hold-up SSD power-loss | EDLC 1 F × 6 / 5.5 V stack (Eaton XL60) |
24. Cross-references
- pcb-design — board-level integration: stack-up, decoupling strategy, return paths.
- pcb-substrates — FR-4, Rogers, polyimide, IMS — what the passives sit on.
- semiconductor-packages — the active devices being filtered / decoupled.
- connector-families — what carries the signals into and out of the passive networks.
- op-amps — front-ends that depend on precision-resistor accuracy.
- power-electronics — SMPS topologies driving the L and C selections.
- op-amp-variants — sibling family-index in the same Tier-3 lineage.
- pcb-design — EMI suppression role of beads, CMCs, X/Y caps.
- battery-chemistries — supercapacitor energy-storage comparison.
25. Citations
- IEC 60384 (Fixed capacitors for use in electronic equipment) — generic + sectional specs by dielectric family.
- IEC 60115 (Fixed resistors for use in electronic equipment) — generic + sectional specs.
- IEC 60938 (Fixed inductors for electromagnetic interference suppression).
- IEC 60384-14 / UL 60384-14 — EMI suppression capacitors connected to mains (X / Y class).
- IEC 60068 — environmental testing.
- IEC 60751 — Industrial platinum-resistance thermometers.
- EIA-RS-198-E — Ceramic dielectric capacitor temperature-characteristic letter codes.
- EIA-RS-481 — Taping of surface-mount components (relevant to package definitions).
- AEC-Q200 Rev D — Stress test qualification for passive components (automotive).
- IPC-2221B — Generic Standard on Printed Board Design (voltage de-rating tables).
- Bogart, T. F., Beasley, J. S., Rico, G. — Electronic Devices and Circuits (8th ed.).
- Ferroxcube — Soft Ferrites and Accessories Data Handbook (current edition).
- Magnetics Inc. — Powder Cores Catalog and Ferrite Cores Catalog.
- Hitachi Metals — Nanocrystalline Soft Magnetic Material Finemet technical handbook.
- Vishay — Wraparound Chip Resistor Application Note (TND-series, 2023).
- KEMET — Capacitor Application Guide (2024 edition).
- Murata — Ceramic Capacitors Product Catalog C02E and DC Bias Characteristics technical note.
- Texas Instruments AN — Power Topologies Handbook (SLYU036) — passive-component sizing examples.
End of file.